Flex Logix and Microsoft work on chip development platform for US Department of Defence

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Flex Logix and Microsoft work on chip development platform for US Department of Defence
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Flex Logix, a supplier of embedded FPGA IP, architecture and software, has been selected by a group of microelectronics companies to build a secure chip development platform for the US Department of Defence (DoD).

The team is being led by Microsoft with the goal of building a chip development platform with the utmost regard for security as part of the DoD RAMP Project.

Flex Logix was chosen for its leading embedded (eFPGA) technology that enables chips to be reconfigurable after tape-out, allowing companies to adapt to new requirements, changing standards and protocols as needed.

“Security can mean a lot of different things. For eFPGA, it means providing a means for keeping circuitry secret by programming the eFPGA in a secure environment,” said Geoff Tate, CEO and co-founder of Flex Logix.

“We’re honored to be working with Microsoft to bring Flex Logix’s eFPGA technology as part of their Advanced Commercial Capabilities project for the DoD RAMP program,” he added.

The RAMP project intends to address and replace the obsolete practices utilised by the United States Government in support of state-of-the-art custom IC and system-on-chip design, especially those associated with physical or “back-end” design. 

Given the long system lifetime of DoD systems, utilising eFPGA provides the capability to make silicon changes to update algorithms or modify functionality and saves money by avoiding costly tape-outs and installation of replacement parts.

Mujtaba Hamid, general manager of silicon, modeling and simulation at Microsoft, said: “Our collaboration with Flex Logix will help to advance flexibility to chip design. The company’s eFPGA technology has demonstrated success in supporting mission-critical applications and we look forward to bringing this capability to support national security priorities.”

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